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TCD2300C 2001-10-15 1 toshiba ccd linear image sensor ccd (charge coupled device ) TCD2300C the tcd2301c which includes sample ? and ? hold circuit and clamp circuit is a high sensitive and low dark current 3648 elements 3 lines ccd color image sensor. the sensor is designed for color scanner. the device contains a row of 3648 element 3 lines photodiodes which provide a 16 lines / mm across a a4 size paper. the device is operated by 5v pulse, and 12v power supply. features number of image sensing elements : 3648 elements 3 lines image sensing element size : 8 m by 8 m on 8 m centers photo sensing region : high sensitive pn photodiode distance between photodiode array : 96 m (12 lines) clock : 2 phase (5v) internal circuit : sample & hold circuit, clamp circuit package : 22 pin dip color filter : red, green, blue maximum ratings (note 1) characteristic symbol rating unit clock pulse voltage v shift pulse voltage v sh reset pulse voltage rs v sample and hold pulse voltage sp v switch pulse voltage sg v clamp pulse voltage cp v ? 0.3~8 v power supply voltage v od ? 0.3~15 v operating temperature t opr 0~60 c storage temperature t stg ? 25~85 c note 1: all voltage are with respect to ss terminals (ground). pin connection (top view) weight: 4.8g (typ.)
TCD2300C 2001-10-15 2 circuit diagram pin names 1e clock 1 (phase 1) sh3 shift gate 3 2e clock 2 (phase 2) rs reset gate 1o clock 1 (phase 1) sp sample and hold gate 2o clock 2 (phase 2) cp clamp gate 1b final stage clock (phase 1) os1 signal output 1 2b final stage clock (phase 2) os2 signal output 2 ss ground os3 signal output 3 od power dos compensation output sh1 shift gate 1 nc non connection sh2 shift gate 2
TCD2300C 2001-10-15 3 optical / electrical characteristics (ta = 25c, v od = 12 v, v = v rs = v sh = v cp = 5 v (pulse), f = 0.51 mhz, f rs = 1.0 mhz, load resistance = 100 k ? , t int (integration time) = 10 ms, light source = a light source + cm500 filter (t = 1.0 mm) ) characteristic symbol min typ. max unit note sensitivity (red) rr D 1.1 D v / lxs (note 2) sensitivity (green) rg D 1.4 D v / lxs (note 2) sensitivity (blue) rb D 0.5 D v / lxs (note 2) prnu (1) D 10 20 % (note 3) photo response non uniformity prnu (3) D 3 12 mv (note 4) register imbalance rl D D 3 % (note 5) saturation output voltage v sat 1.0 1.5 D v (note 6) saturation exposure se D 1.07 D lxs (note 7) dark signal voltage v drk D D 2.0 mv (note 8) dark signal non uniformity dsnu D D 3.0 mv (note 9) total transfer efficiency tte 92 D D % output impedance z o D 0.5 1.0 k ? dc power dissipation p d D 500 750 mw dc offset voltage v os D 6.0 D v (note 10) dc compensation output voltage v dos D 6.0 D v (note 10) dc mismach voltage |v dos ? v dos | D 100 300 mv (note 10) note 2: sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. note 3: prnu (1) is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. 100(%) ) 1 ( prnu when is average of total signal output and is the maximum deviation from . the amount of incident light is shown below. red = 2 1 se green = 2 1 se bule = 4 1 se
TCD2300C 2001-10-15 4 note 4: prnu (3) is defined as maximum voltage with next pixel, where measured 5% of se (typ.). note 5: ri is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. (%) 100 3647 3647 1 n 1 + n - n rl where n and n+1 are signal outputs of each pixel. is average of total signal outputs. note 6: v sat is defined as minimum saturation output of all effective pixels. note 7: definition of se: g r sat v se note 8: v drk is defined as average dark signal voltage of all effective pixels. note 9: dsnu is defined as different voltage between v drk and v mdk when v mdk is maximum dark voltage. note 10: dc signal output voltage and dc compensation output voltage are defined as follows:
TCD2300C 2001-10-15 5 operating condition characteristic symbol min typ. max unit note ?h? level 4.5 5.0 5.5 clock pulse voltage ?l? level v 0, e 0.0 0.2 0.5 v ?h? level 4.5 5.0 5.5 final stage clock pulse voltage ?l? level v b 0.0 0.2 0.5 v ?h? level v 0,e?h? ? 1 v 0, e ?h? v 0, e ?h? shift pulse voltage ?l? level v sh 0.0 0.2 0.5 v (note 11) ?h? level 4.5 5.0 5.5 reset pulse voltage ?l? level v rs 0.0 0.2 0.5 v ?h? level 4.5 5.0 5.5 sample and hold pulse voltage ?l? level v sp 0.0 0.2 0.5 v (note 12) ?h? level 4.5 5.0 5.5 clamp pulse voltage ?l? level v cp 0.0 0.2 0.5 v (note 13) power supply voltage v od 11.4 12.0 13.0 v note 11: v 0, e ?h? means the high level voltage of v 0 and v e when sh pulse is high level. note 12: supply ?l? level to sp terminal when sample ? and ? hold circuit is not used. note 13: supply sh (inversed pulse of sh) to cp terminal when clamp circuit is not used. clock characteristics (ta = 25c) characteristic symbol min typ. max unit clock pulse frequency f D 0.5 2.0 mhz reset pulse frequency rs f D 1.0 4.0 mhz sample and hold pulse frequency sp f D 1.0 4.0 mhz clamp pulse frequency cp f D 1.0 4.0 mhz clock capacitance c 0, e D 500 D pf final stage clock capacitance c b D 10 D pf shift gate capacitance c sh D 200 D pf reset gate capacitance rs c D 10 D pf sample and hold gate capacitance sp c D 10 D pf rgb switch pulse capacitance sg c D 10 D pf clamp gate capacitance cp c D 10 D pf
TCD2300C 2001-10-15 6 timing chart
TCD2300C 2001-10-15 7 timing requirements
TCD2300C 2001-10-15 8 timing requirements (cont.) characteristic symbol min. typ. (note 14) max. unit pulse timing of sh and 1,0 t1, t5 0 1000 D ns sh pulse rise time, fall time t2, t4 0 50 D ns sh pulse width t3 500 1000 D ns 1 , 2 pulse rise time, fall time t6, t7 0 50 D ns rs pulse rise time, fall time t8, t10 0 20 D ns rs pulse width t9 40 250 D ns pulse timing of 1b , 2b and rs t11 120 300 D ns sp pulse rise time, fall time t12, t14 0 20 D ns sp pulse width t13 70 100 D ns pulse timing of sp and rs t15 0 50 D ns video data delay time (note 15) t16, t17 D 70 D ns cp pulse rise time, fall time t18, t20 0 20 D ns cp pulse width t19 100 200 D ns pulse timing of 1b , 2b and cp t21 20 50 D ns pulse timing of rs and cp t22 0 50 D ns note 14: typ. is the case of f rs = 1.0mhz note 15: load resistance is 100k ?
TCD2300C 2001-10-15 9 typical spectral response
TCD2300C 2001-10-15 10 typical drive circuit
TCD2300C 2001-10-15 11 caution 1. window glass the dust and stain on the glass window of the package degrade optical performance of ccd sensor. keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry n2. care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. electrostatic breakdown store in shorting clip or in conductive foam to avoid electrostatic breakdown. ccd image sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. in handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. ground the tools such as soldering iron, radio cutting pliers of or pincer. it is not necessarily required to execute all precaution items for static electricity. it is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. incident light ccd sensor is sensitive to infrared light. note that infrared light component degrades resolution and prnu of ccd sensor. 4. soldering soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260c, or within three seconds for lead temperatures of up to 350c.
TCD2300C 2001-10-15 12 even ? odd unbalance when high ? speed draiving standard level of odd ? even bits is often unbalanced. for that reason when high ? speed draiving ccd you should put a damping resistance in input pin. 1. waveform (sample and hold on) 2. measurement condition ta = 25c, v ad = v dd = 12v, v 1e = v 10 = v 1b = v 2e = v 20 = v 2b = v rs = v cp = v sp = v sh1 = v sh2 = v sh3 = 5v (pulse), light source = daylight fluorescent lamp. ocilloscope tektoronix 2465a (400mhz) probe p6136 10.8pf
TCD2300C 2001-10-15 13 3. drive circuit (with a damping resistance) please put a damping resistance in input 1e (15 ? ).
TCD2300C 2001-10-15 14 package dimensions note 1: no.1 sensor element (s1) to edge of package. note 2: top of chip to bottom of package. note 3: glass thickness (n = 1.5) weight: 4.8g (typ.)
TCD2300C 2001-10-15 15 toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. the products described in this document are subject to the foreign exchange and foreign trade laws. the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others. the information contained herein is subject to change without notice. 000707eb a restrictions on product use

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